Todd Barnum, COO of Linton Crystal Technologies, was invited to provide comments as part of the “Virtual Forum for Risks in the Semiconductor Manufacturing and Advanced Packaging Supply Chain.” The discussion was held on April 8, by the Bureau of Industry and Security (BIS), Office of Technology Evaluation, of the U.S. Department of Commerce.

President Biden’s February 24 Executive Order on “America’s Supply Chains,” requires the Secretary of Commerce to (within 100 days) provide a report identifying risks in the semiconductor manufacturing and advanced packaging supply chains, with proposed policy recommendations to address these risks. BIS has been compiling public comments and information to assist the Department of Commerce in preparing that report. Barnum previously provided written comments to the BIS as part of this effort.

During the forum, participants addressed the policy objectives listed in the Executive Order as they affect the U.S. semiconductor manufacturing and advanced packaging supply chains.

Barnum explained, “My interest in this forum is in keeping jobs for my people here in the United States, growing our U.S. presence and capabilities, strengthening the supply chain and ensuring there is a future for wafer production in the U.S.” He noted, “We should be looking to grants, incentives, subsidies, and tax credits,” to do so, adding existing or new tariffs are not a solution.

BIS will add a link to a recording of the virtual forum, as well as a written transcript, to its website (https://www.bis.doc.gov/semiconductorforum) by April 15.